The Impact of Thermal Management in Electronics Design from Wearable Electronics, IoT to Data Centers
By Kaveh Azar, Ph.D., President and CEO, Advanced Thermal Solutions, Inc.
In the past 20 years we have witnessed a paradigm shift in the way electronics and the Internet have influenced our lives. The nineties was the era of expanding the World Wide Web’s infrastructure and building access to this massive information-highway. The decade of 2000 embraced the penetration of the web into our lives and the transport of information to the point of use, be it a nuclear power plant or a portable electronics. And now, the Internet of Things (IoT) is bringing the next wave of change, ushering in the connectivity to data and its processing as never before. This new architecture is changing the requirements of electronics design and the speed by which it is delivered. The success of such effort s pivots around speed of processing and delivery --- mandating electronics that can operate at much higher frequency with higher reliability, irrespective of their end-use.
Speed is directly correlated to power and power results in heat, heat adversely impacts speed and reliability. With the hyper-competitive market, the winning product is the one that is first-to-market with the least-cost and highest-reliability. Hence, the foundation of a successful design is poured at the design stage where the right design mitigates heat related failures and costs, be it loss of speed, system failures in terms of bit error, malfunction or a costly product due to cooling requirements.
In this presentation, thermal management of electronics is reviewed and the important role that circuit design plays in mitigating such heat-related challenges is discussed. Whether a system is a handheld device or high-speed computing, thermal coupling between system components plays a menacing role in its successful operation. The presentation will show how thermal coupling occurs and the means of managing it at the design stage to help reduce its impact. The Presentation will conclude with a high-level review of available cooling technologies and what measures can be taken with respect to design and packaging at the component and the PCB levels in designing a product that is right-the-first-time, with the least-cost and highest reliability.
PLEASE NOTE: The meeting is open to the public. No charge for Consultants Network members or employees of Constant Contact; $5 entrance fee for all others. Casual dress.
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